EKK, Inc. News Letter - June 2002


User Meeting

The user meeting scheduled for the 13th of June is fast approaching. We are happy to say that 80% of our North American users are planning to attend.

The schedule for the meeting follows:

9:00 - 9:30
     Welcome
9:30 - 10:15
     MESHID / CAPOST Updates - Ken Siersma
10:15 - 11:00
     WRAFTS 2003 - Gerald Backer
11:00 - 11:15
     Break
11:15 - 12:00
     KENT / CAP Updates - Ken Siersma
12:00 - 1:00
     Lunch
1:00 - 3:15
     Technical Presentations
1:00 - 1:45:  Sand castings - Marty McLaughlin
1:45 - 2:15:  Benchmarks / Hardware - John Nitz and Ken Siersma
2:15 - 2:30:  Break
2:30 - 3:15:  Current EKK Research Projects - Marty McLaughlin

3:15 - 5:00
     Open discussion, questions and answers


EKK Involvement in Current Research Projects

In our bid to spread our knowledge and influence throughout the known universe and beyond, EKK (Marty) is heavily involved in the following projects:

USCAR Structural Cast Magnesium Development (SCMD) - We are assisting in the development of lightweight magnesium auto structural components to enhance the fuel efficiency of future automobiles. Also involved in this project are: The Big Three (GM, Ford, DCX), Gibbs Die Casting, Sandia and Oakridge National Labs, just to name a few.

USCAR Magnesium Powertrain Casting Components (MPCC) program - Much like the USCAR project listed above, the aim of this project is to develop engine components out of magnesium. EKK joins a cast that includes GM, Ford, DCX, Intermet, JLFrench, and Hayes-Lemmerz.

DOE study - EKK is involved with The University of Michigan, The University of Mississippi, Hayez-Lemmerz, Intermet, and Ford among others to study heat transfer coefficient properties for use in industry and academia. This project is funded by the Department of Energy.


Did You Know?

First, did you know that the material properties used in our software are easily customized? The user is free to adjust all material properties used by all of our analysis software. Not only that, but the solidification software (CAP) is able to use temperature dependent thermophysical properties. This includes heat transfer coefficients between die components, thermal conductivity, density, and specific heat.


Previous news letters

May 2002

April 2002

Old News